| Electrochemical Analysis of a Polypyrrole/Al Flake Pigmented Epoxy Primer for Corrosion Inhibition on Al 2024 T3 | ||
| Victoria Johnston Gelling, Chris Vetter, Xiaoning Qi, and Subramanyam V. Kasisomayajula, North Dakota State University Recent research has shown that electroactive conducting polymers such as polypyrrole are capable of inhibiting corrosion on a variety of metal substrates. This corrosion inhibiting behavior can be due to several different mechanisms such as a potential shift of the metal in the noble direction, the release of a corrosion inhibiting anion, or the exclusion of corrosion accelerating ions such as chlorine from the metal surface. There are several problems, however, in the application of polypyrrole. The largest is its poor solubility in common solvents, which make casting a polypyrrole film exceedingly difficult. One solution to this problem has been to directly deposit polypyrrole onto metal substrates using electrochemical polymerization. This is a limited technique however as it is difficult to scale up for use in industry and can only be used for conductive substrates. In this study, a copolymer containing polypyrrole, catechol, and phloroglucide was deposited, using an aqueous chemical polymerization process that is easily be scaled up, onto an aluminum flake pigment. The resulting composite material was incorporated into an epoxy primer and applied to Al 2024 panels. The coated panels were exposed to B117 salt spray and evaluated using electrochemical impedance spectroscopy, open circuit potential measurements, scanning vibrating electrode technique, and visual assessment. | ||