| RAPID ELECTROCHEMICAL METHODS FOR TESTING CORROSION PROTECTIVE COMPOUNDS | ||
| Mr. Michael Cunningham, B.S., Dr. Young Chung, Ph.D., and Dr. Martin Kendig, Ph.D., Teledyne Scientific Company; Mr. Mark Lovil, CEO, Rite-Kem Incorporated Corrosion protective compounds or CPCs have been used to penetrate crevices and displace water leaving a waxy hydrophobic barrier film. A number of different products have been used for this purpose, often formulated for the particular application. Some of the of the commercial materials used to meet the Boeing BMS 23 specification contain compounds specifically designed as water displacing agents and corrosion inhibitors. Most CPC development effort has focused on optimizing the barrier and water-displacing properties of CPCs. Recent work at Teledyne Scientific has identified organic inhibitors that slow the oxygen reduction half of the corrosion reaction. These inhibitors are particularly effective for Cu cathodes, making them attractive for the inhibition of corrosion of Cu-containing alloys and electronic connectors. In addition, formulations of CPCs containing these inhibitors release them slowly to provide a self-healing mechanism that extends their useful life. In order to develop and optimize CPC formulations with such ‘active’ corrosion inhibitors , we have identified and developed several rapid screening tests. They are: (1) water-displacement from a hydrophilic, water-filmed surface, (2) water displacement and corrosion inhibition within a crevice using a ZRA, (3) electrochemical impedance spectroscopy of CPC films to evaluate barrier properties of dried films, and (4) rotating disk cathode detection of inhibitor release. Examples of these rapid test methods will be presented and discussed in the context of developing an ‘active’ CPC. This work was supported by Rite-Kem Inc., Tupelo, MS under contract number FA8650-05-D-5807. | ||